A recently published patent filing from Sony could indicate a shift in cooling technology for the PlayStation 6, potentially addressing issues that have plagued some PlayStation 5 units. The patent describes a revised heatsink designed to improve cooling capacity regardless of the console's orientation.
The current PlayStation 5 utilizes a liquid metal cooling system, which, while effective in many scenarios, has been linked to leaks and overheating problems for some users. These issues sparked considerable debate about the safety of placing the PS5 vertically, with some speculating that gravity could exacerbate leaks. While Sony never officially confirmed these concerns, subtle modifications were made to the heatsinks in the PS5 Slim and Pro models, featuring deeper grooves and altered application patterns that seemed to mitigate spill and overheating incidents.
The new patent, filed in early 2026 and published in April, details an "electronic device that can improve cooling capacity of a heating element built into an electronic device disposed in a plurality of postures." This suggests a move towards a more traditional liquid cooling method that would enhance heat transfer efficiency in both horizontal and vertical orientations, aiming to provide a more consistent and reliable thermal solution. Such a revision would be particularly important if any version of the PS6 is designed as a handheld device, where robust and leak-proof cooling would be paramount.